3M 1183 Tin-Plated Copper Foil With Conductive Adhesive Tape For EMI Shielding, Grounding, LV Conductor

3M 1183 Tin-Plated Copper Foil With Conductive Adhesive Tape For EMI Shielding, Grounding, LV Conductor

3M Tin-Plated Copper Foil Tape 1183 consists of a 1-ounce dead soft tin-plated copper foil backing and an electrically conductive, pressure-sensitive acrylic adhesive. This tape is supplied on a removable liner for easy handling and die-cutting. It has excellent solderability .

Description

3M 1183 Tin-Plated Copper Foil with Conductive Adhesive Tape for EMI Shielding, Grounding, LV Conductor

3M Tin-Plated Copper Foil Tape 1183 consists of a 1-ounce dead soft tin-plated copper foil backing and an electrically conductive, pressure-sensitive acrylic adhesive. This tape is supplied on a removable liner for easy handling and die-cutting. It has excellent solderability .

 

 Features:

  • Tin-plating facilitates soldering to the backing and resists oxidation and corrosion.

  • Conductive particles in the adhesive provides low contact resistance between the substrate and the backing to drain static charge.

  • Acrylic pressure-sensitive adhesive has good resistance to heat, oxidation, solvents and oils.

  • Removable liner makes it easy to handle and die cut complex shapes.

  • There are both standard and custom roll widths and lengths to meet a variety of application needs.


Typical Physical Properties:

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Applications:
Tin-Plated Copper Foil Tape 1183 is typically used for applications requiring excellent electrical conductivity from the application substrate through the adhesive to the foil backing. Common uses include grounding and EMI shielding in equipment, components, shielded rooms, etc. The tin plating facilitates soldering to the backing and resists oxidation and corrosion.


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