Die Cutting Thermally Conductive Silicone Rubber Pad For Smart Phone /LED Light

Die Cutting Thermally Conductive Silicone Rubber Pad For Smart Phone /LED Light

Thermal Interface Materials are widely used for the heat conduction of IC and electronic products, which is to fill the small gap and rough holes between two material, to reduce the thermal resistance and improve the thermal conductive performance.

Description

Introduction:

Thermal conductive silicon pad is high-performance, thermal conductive gap filling materials, mainly for thetransmission interface between the electronic equipment and heat sink or product outer coving. Nice stickiness,flexibility, good compression performance and excellent heat conductivity are designed for  it, which make the products can discharge gas from the electronic original and heat sink, to achieve fully conforming and obviously cooling effect. compared to common thermal conductive & insulating materials,


Features:

1. Reusable, convenient to install and test;it is an excellent thermal filler material.

2. Thermal silica, with sound absorbing and shock absorbing effect.

3. Widely used in the control board of electronic product, and the motor, electronics auto mechanics, and any desired material filling and cooling modules.

4. The role of thermal silica: Insulation, thermal conductivity, wear-resistant, fire-retardant, filling gaps, compression, buffering, etc.


Physical Properties:

Test Content

Typical Value 

 Test Method

Color

Dark gary

Visual 

Specs

200x400 mm / 320x320 mm

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Thickness

0.30 -14.0mm

ASTM D374

Density

2.85g/cc

ASTM D792

Hardness

45-80°C Shore C

ASTM D2240

Continuous Temp

-40 to 160°C

EN 344

Breakdown Voltage

5000 VAC/mm

ASTM D149

Volume Impedance

1.5×1016Ω.cm

ASTM D527

Weight Damnify

≤1%  @200°C 24H

ASTM E595

Flame Rating

94 V0

UL-94

Thermal Conductivity

3.0W/m-k

ASTM D5470

Applications:

Electronic components: IC, CPU, MOS, LED, M/B, P/S, Heat Sink,

LCD-TV, Notebook PC, PC, Telecom Device, Wireless Hub…..etc

DDR ll Module, DVD Applications, Hand-set applications…..etc


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