NITTO 6250 QFN package tape
Outstanding heat resistance.
Optimum for temporary fixing and masking in heating processes, and for protection and transport of film components.
Suitable adjustments can be made for processed products.
Carrier: Support for thin-layer materials and protection during transport
Temporary fixing: Temporary fixing manufacturing processes riring high-temperature
Masking: Masking for package manufacturing processes
Surface protection: Protection of CCD glass
Dam: Prevents resin leakage when molding semiconductor packages and electronic components