NITTO 6250 QFN Package Tape

NITTO 6250 QFN Package Tape

NITTO 6250 QFN package tape Nitto 6250 is a product which combines Nitto Denko's advanced adhesion controlled technology with heat resistant base materials and adhesives, and is applied in various electronic components and device processes. Feature: Outstanding heat resistance. Optimum for...

Description

NITTO 6250 QFN package tape

Nitto 6250 is a product which combines Nitto Denko's advanced adhesion controlled technology with heat resistant base materials and adhesives, and is applied in various electronic components and device processes.
 

Feature:

  • Outstanding heat resistance.

  • Optimum for temporary fixing and masking in heating processes, and for protection and transport of film components.

  • Suitable adjustments can be made for processed products.

Applcations:

  • Carrier: Support for thin-layer materials and protection during transport

  • Temporary fixing: Temporary fixing manufacturing processes riring high-temperature

  • Masking: Masking for package manufacturing processes

  • Surface protection: Protection of CCD glass

  • Dam: Prevents resin leakage when molding semiconductor packages and electronic components

If the nitto 6250 qfn package tape caters to your requirement, please be free to buy the quality products made in China with our professional manufacturers and suppliers in China. We're equipped with a productive factory at your service.
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