Xinst6050-15H Equal To Nitto Denko Thermal Release Tape For Semiconductor
Tightly adheres and can easily be peeled off just by heating; perfect for temporary fixing.
The signel thermal release tape is a unique adhesive tape that adheres tightly at room temperature and can easily be peeled off just by heating. The tape contributes significantly to automation/laborsaving of various electronic component manufacturing processes.
• Adheres just like any normal adhesive tape at room temperature; can easily be peeled off when necessary by just heating.
• Various shapes available such as in sheets, rolls and labelers.
• Available to select temperatures for releasing (125-135°C).Time are 3-5 minutes.
• Contributes to automation/laborsaving since the tape can be removed at a uniform temperature.
• Does not damage substrates upon tape removal.
• For electronic component manufacturing processes.
• For various temporary fixing.
Thickness of Backing
Thermal Release Adhesive
Thickness of Adhesive
180 degree Peel Adhesion
After Heat 140℃,10min,180 degree Peel Adhesion
If the equal to nitto denko thermal release tape for semiconductor caters to your requirement, please be free to buy the quality products made in China with our professional manufacturers and suppliers in China. We're equipped with a productive factory at your service.