Xinst6011-15 Degree Release Thermal Release Tape For MLCC Dicing FPCB Etching

Descriptions: The thermal release tape is a unique adhesive tape that adheres tightly at room temperature and can easily be peeled off just by heating. The tape contributes significantly to automation/laborsaving of various electronic component manufacturing processes. Features: • Adheres just...

Description

Xinst6011-15 Degree Release Thermal Release Tape For MLCC Dicing FPCB Etching

Descriptions:
The thermal release tape is a unique adhesive tape that adheres tightly at room temperature and can easily be peeled off just by heating. The tape contributes significantly to automation/laborsaving of various electronic component manufacturing processes.

We also have the Thermal Double Sided Tape and one sided is thermal release adhesive,and the other sided is position adheisve.


Features:
• Adheres just like any normal adhesive tape at room temperature; can easily be peeled off when necessary by just heating.
• Various shapes available such as in sheets, rolls and labelers.
• Available to select temperatures for releasing (90-100°C).Time are 1-3 minutes.
• Contributes to automation/laborsaving since the tape can be removed at a uniform temperature.
• Does not damage substrates upon tape removal.


Applications:
• For electronic component manufacturing processes.
• For various temporary fixing.


Structure:

Specifications:


Backing

Polyester

Color

Dark Green

Thickness of Backing

0.1mm

Adhesive

Thermal Release Adhesive

Thickness of Adhesive

0.05mm

Total Thickness

0.15mm

Release Liner

0.025mm

180 degree Peel Adhesion

750g/25mm

After Heat 90℃,1min,180 degree Peel Adhesion

25g/25mm

Elongation(%)

120

Storage Validity

12 months







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