Xinst6011-15 Degree Release Thermal Release Tape For MLCC Dicing FPCB Etching
The thermal release tape is a unique adhesive tape that adheres tightly at room temperature and can easily be peeled off just by heating. The tape contributes significantly to automation/laborsaving of various electronic component manufacturing processes.
We also have the Thermal Double Sided Tape and one sided is thermal release adhesive,and the other sided is position adheisve.
• Adheres just like any normal adhesive tape at room temperature; can easily be peeled off when necessary by just heating.
• Various shapes available such as in sheets, rolls and labelers.
• Available to select temperatures for releasing (90-100°C).Time are 1-3 minutes.
• Contributes to automation/laborsaving since the tape can be removed at a uniform temperature.
• Does not damage substrates upon tape removal.
• For electronic component manufacturing processes.
• For various temporary fixing.
Thickness of Backing
Thermal Release Adhesive
Thickness of Adhesive
After Heat 90℃,1min,180 degree Peel Adhesion
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