Manufacture Wafer UV Dicing Tape For Semiconductor Cutting

Descriptions: UV Dicing Tape an ultra-strong adhesion UV tape, specially designed for deep-cutting process of LED modules, QFN chips, camera modules, etc. It sustains a strong adhesion during dicing and can turn to very low adhesion after UV exposure, then easily peeled off. Features: •The PO...

Description

Manufacture Wafer UV Dicing Tape For Semiconductor Cutting

Descriptions:
UV Dicing Tape an ultra-strong adhesion UV tape, specially designed for deep-cutting process of LED modules, QFN chips, camera modules, etc. It sustains a strong adhesion during dicing and can turn to very low adhesion after UV exposure, then easily peeled off.


Features:
•The PO film was single coated with special adhesive which has high adhesion. With this tape, the wafer or glass would not fall off or fly off during grinding and dicing.
• Not any residue on the surface of wafer or glass which is good for processing.
• High adhesion before UV.Once UV-light is exposed on, the adhesion is reduced and it can be removed easily


Applications:
•The tape is designed for deep-cutting process of LED modules, QFN chips, camera modules.


Specifications:

Item

Xinst130 UV Dicing Tape

Backing

PO Film

Thickness

PO Film

mm

0.1±0.02

Adhesive                      

mm

0.03+0.002

Adhesion

Before UV

N/10mm

2.90

After UV

N/10mm

0.08

Holding Power

---

mm

<0.10

Tensile Strength

TD

N/10mm

30

MD

N/10mm

30

Elongation

TD

%/10mm

900

MD

%/10mm

840




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