Manufacture Wafer UV Dicing Tape For Semiconductor Cutting
UV Dicing Tape an ultra-strong adhesion UV tape, specially designed for deep-cutting process of LED modules, QFN chips, camera modules, etc. It sustains a strong adhesion during dicing and can turn to very low adhesion after UV exposure, then easily peeled off.
•The PO film was single coated with special adhesive which has high adhesion. With this tape, the wafer or glass would not fall off or fly off during grinding and dicing.
• Not any residue on the surface of wafer or glass which is good for processing.
• High adhesion before UV.Once UV-light is exposed on, the adhesion is reduced and it can be removed easily
•The tape is designed for deep-cutting process of LED modules, QFN chips, camera modules.
Xinst130 UV Dicing Tape
If the manufacture wafer uv dicing tape for semiconductor cutting caters to your requirement, please be free to buy the quality products made in China with our professional manufacturers and suppliers in China. We're equipped with a productive factory at your service.