Thermal conductive glue is made of an advanced thermal conductive pressure sensitive adhesive.Xinst-P80XXN series provides a better way for applications requiring good adhesion strength and superior thermal conductive efficiency. Xinst-P80XXN series is suitable to apply to electronic mechanical components assembly such as the heat sink module and LED light bar module to provide a better heat-transfer path between heat-generating components and heat sink or other cooling devices.
• Complete thickness standard is available.
• Various structures are for different applications.
• Stable and economic.
• Superior adhesion strength and thermal conductive efficiency.
• Assembly of the heat sink and DDR-RAM module.
• Assembly of the LED light bar module and metal frame bezel.
• Die-cut piece and Laminate.
• Applied to the chip, flexible circuit boards and high-power transistors and heat sinks or other cooling device bonding.
Xinst P80XXN Thermal Conductive Adhesive Tape
Tape Total Thickness Tolerance
180 Peel Adhesion (PSTC-101) (N/25mm)
Temperature Tolerance Long Term ℃ (℉)
Thermal Conductivit（ASTM D22470（W/m-k）
Temperature Range of Usage
Storage and Shelf Life
Store in original cartons at 23℃±5℃ and 60%±10% relative humidity in order to obtain best performance, besides use these products within 15 months from date of manufacture.
This document is the property of Xinst. Please consult with us before using this document for any purpose other than that for which it was intended. The data provided herein are measurement only and are not guaranteed. Please make sure the product is capable of the application before actually tempting to put it to use. Users assume all risk and liability associated with such use.
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